Tempo

Tempo is a California-based manufacturing company that designs and distributes printed circuit boards for industries such as automotive and aviation.

Business Model: B2C

Revenue: $0

Employees: 2-10

Detailed Tempo Information

Geographic Data

Tempo headquarters map

Address: 2460 Alameda Street

City: San Francisco

State: CA

Zip: 94103

Country: US

Financial Info

Stage:

series c

Raised Last:

$45M

Raised Total:

$75M

Metrics

851,181Website Global Rank

43,042Website Monthly Traffic

Twitter Followers

Description

Tempo is a California-based manufacturing company that designs and distributes printed circuit boards for industries such as automotive and aviation.

Contact Phone:
+14153201261

Contact Email:

Tempo went public on the NASDAQ

Listed Exchange:
NASDAQ

Ticker Symbol:
TMPO

Live

Opened: -/share

EBITDA -
Total Cash -
Total Debt -
Total Revenue -
Total Profit (Gross) -
PE Ratio -
Announced Date Company Transaction Money Raised
Announced Date Transaction Number of Investors Money Raised Lead Investors
11/2022 Post-IPO Equity - Point72 Ventures
Lux Capital
Firsthand Technology Value Fund
Ace Equity Partners
Point72 Ventures
Lux Capital
Firsthand Technology Value Fund
Ace Equity Partners
1/2015 Venture Round 1 - Keiretsu Forum
Keiretsu Forum
6/2016 Series A 4 $8M Lux Capital
Uncork Capital
Bolt
AME Cloud Ventures
Lux Capital
11/2022 IPO SPAC -
1/2022 Post-IPO Debt $200M Oaktree Capital Management, L.P.
4/2019 Series C $45.1M Point72 Ventures
Lockheed Martin
Lux Capital
Uncork Capital
4/2020 Debt $2M U.S. Small Business Administration.
10/2021 PIPE $82M Point72 Ventures Investments
ACE Equity Partners
Firsthand Funds
Lux Capital
5/2019 Series C 5 $45M Point72 Ventures
Lockheed Martin Ventures
Uncork Capital
Lux Capital
Alumni Ventures
Point72 Ventures
Point72 Ventures
Lockheed Martin Ventures
Uncork Capital
Lux Capital
Alumni Ventures
Point72 Ventures
8/2017 Series B 7 $20M Point72 Ventures
Industry Ventures
Cendana Capital
AME Cloud Ventures
Uncork Capital
Point72 Ventures
Lux Capital
Dolby Family Ventures
Point72 Ventures
Industry Ventures
Cendana Capital
AME Cloud Ventures
Uncork Capital
Point72 Ventures
1/2015 Seed Round 7 $1.6M Uncork Capital
OS Fund
Lena Street
Jeff McAlvay
Haystack
Draper Associates
Bolt
Uncork Capital
11/2022 Post-IPO Debt 3 $79M Structural Capital
SQN Venture Partners
Ace Equity Partners
Structural Capital
SQN Venture Partners
Ace Equity Partners
11/2022 IPO SPAC -

1/2015 Venture Round 1 -
Announced Date Name Price
10/2021 Advanced Circuits

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