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Detailed Teng Fei Technology Information
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Raised Last:
$488k
Raised Total:$488k
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Description
Teng Fei Technology is a production and sales of seamless underwear and mold cups. Their technology includes senslast print, 3d senselast print, limax, smart wearable, sola, skin foam, and other materials, focusing on underwear, shapewear, sportswear, smart wearables, and other fields.
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Teng Fei Technology went public on 7/29/2015 on the NEEQ
Listed Exchange:
NEEQ
IPO Date:
7/29/2015
Ticker Symbol:
833085
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