Business Model:
Revenue: $0
Employees: 0-0
Rankings
Industries / Tags:
Detailed Hangzhou Leon Dongxin Microelectronics Information
Geographic Data
Address:
City:
State:
Zip:
Country:
Financial Info
Stage:
Raised Last:
$0
Raised Total:$0
Social
Crunchbase
Metrics
0Website Global Rank
0Website Monthly Traffic
Twitter Followers
Description
Hangzhou Leon Dongxin Microelectronics is a supplier of international microwave radio frequency integrated circuit chips. It has developed highly integrated indium gallium phosphorus heterojunction bipolar transistors (InGaP HBT), gallium arsenide pseudo-matched high electron mobility transistors (GaAs pHEMT), and BiHEMT radiofrequency Integrated Circuit (RFIC) production technology, developed VCSEL, DOE, ITO, and Hall sensor production technology. The company has built a production line with an annual output of 50,000 6-inch gallium arsenide chips, breaking through major technical nodes, filling in a number of technical gaps, and leading the technological progress of this industry.
Contact Phone:
Contact Email:
Hangzhou Leon Dongxin Microelectronics went public on 9/11/2020 on the SSE
Listed Exchange:
SSE
IPO Date:
9/11/2020
Ticker Symbol:
605358
Live
Opened: -/share
| EBITDA | - |
| Total Cash | - |
| Total Debt | - |
| Total Revenue | - |
| Total Profit (Gross) | - |
| PE Ratio | - |
| Announced Date | Company | Transaction | Money Raised |
|---|---|---|---|
| 5/2023 | Semitech | Series C | 0 |
| 12/2022 | Jinruihong Microelectronics | Private Equity Round | - |
| 12/2022 | Jinruihong Microelectronics | Private Equity Round | - |
Startup Industries
Startup Locations
Portfolio Current Status
Portfolio Employee Count
| Name | Price |
|---|
| Name | Size | Announced Date |
|---|
