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Detailed Hangzhou Leon Dongxin Microelectronics Information
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Description
Hangzhou Leon Dongxin Microelectronics is a supplier of international microwave radio frequency integrated circuit chips. It has developed highly integrated indium gallium phosphorus heterojunction bipolar transistors (InGaP HBT), gallium arsenide pseudo-matched high electron mobility transistors (GaAs pHEMT), and BiHEMT radiofrequency Integrated Circuit (RFIC) production technology, developed VCSEL, DOE, ITO, and Hall sensor production technology. The company has built a production line with an annual output of 50,000 6-inch gallium arsenide chips, breaking through major technical nodes, filling in a number of technical gaps, and leading the technological progress of this industry.
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Hangzhou Leon Dongxin Microelectronics went public on 9/11/2020 on the SSE
Listed Exchange:
SSE
IPO Date:
9/11/2020
Ticker Symbol:
605358
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| Announced Date | Company | Transaction | Money Raised |
|---|---|---|---|
| 12/2022 | Jinruihong Microelectronics | Private Equity Round | - |
| 5/2023 | Semitech | Series C | 0 |
| 12/2022 | Jinruihong Microelectronics | Private Equity Round | - |
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