Shenzhen Dewo Advanced Automation Corporation is a manufacturer of wire bonding equipment.
Business Model:
Revenue: $0
Employees: 11-50
Address:
City: Baoan
State: Guangdong
Zip:
Country: China
Shenzhen Dewo Advanced Automation Corporation produces wire bonding equipment, integrating R and D, design, production, and sales. Their products such as semiconductor IC packaging, LED packaging, and precision electronic equipment. Their solutions such as SOP wire bonding solutions, LED packaging wire bonding solutions, SOT23 package wire bonding solutions, quad flat no-lead packages, quad flat no-lead packages, and quad flat no-lead package, quad flat no-lead packages.
Contact Phone:
Contact Email:
Announced Date | Company | Transaction | Money Raised |
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Announced Date | Transaction | Number of Investors | Money Raised | Lead Investors | 12/2022 | Series A | 3 | - |
Hiway Capital QF Capital Shanshan Venture Capital Hiway Capital QF Capital Shanshan Venture Capital |
12/2022 | Series A | 3 | - |
Hiway Capital QF Capital Shanshan Venture Capital Hiway Capital QF Capital Shanshan Venture Capital |
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