Boschman Technologies is specializes in the development and supply of advanced transfer molding and sintering systems for electronic.
Business Model: B2C
Revenue: $0
Employees: 1-10
Address:
City: Duiven
State: Gelderland
Zip:
Country: The Netherlands
Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages. Our focus is on the following market segments: Smartcards and discrete packages MEMS and sensor packages Leadless and substrate-based packages Special application packages We regularly join forces with R&a;D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market.
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Announced Date | Company | Transaction | Money Raised |
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Announced Date | Transaction | Number of Investors | Money Raised | Lead Investors | 3/2017 | Private Equity Round | 1 | - |
Holland Capital Holland Capital |
3/2017 | Private Equity Round | 1 | - |
Holland Capital Holland Capital |
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