Atsana Semiconductor

Address:

City: Ottawa

State: Ontario

Zip:

Country: Canada

Atsana&s;s initial market focus is on media processor solutions for wireless media (video, image and audio) applications. Atsana&s;s media processors enable wireless smart phones and PC /network cameras, to deliver multimedia applications such as multimedia messaging, interactive video communications, video streaming and other future media rich content without sacrificing battery life or performance. Atsana&s;s solution fits consumer electronic OEMs growing needs for lower power, higher resolution and programmability. At the heart of Atsana&s;s media processors is a massively parallel, highly scalable, low-power architecture. The patent pending architecture integrates thousands of processing elements into an array of Random Access Memory (RAM). Atsana&s;s media processors deliver the muscle required for encoding or decoding to standards such as MPEG-4, MJPEG or JPEG2000. Atsana provides a total solution including a full suite of algorithms and a software developer&s;s kit for third party developers to create their own applications. Atsana&s;s architecture offers significant power savings by processing media data intelligently, in a massively parallel manner. The achieved efficiencies are critical given the processing demands media applications place on wireless appliances. Because Atsana&s;s processors are programmable they empower OEMs to evolve their products in line with consumers&s; changing requirements for new applications and higher performance. Atsana&s;s management team is composed of seasoned technology professionals. Alex Leupp, PhD, President and CEO of Atsana, has a diversified and proven track record in the semiconductor industry. During his six years as President and Chief Executive Officer of Siemens Microelectronics Inc., Mr. Leupp managed a multi-faceted organization of about 2,500 employees. Most recently, Mr. Leupp was President and Chief Executive Officer of 3dfx Interactive, a high performance graphics chip manufacturer. Michael Krause, Atsana&s;s COO, brings 19 years of semiconductor industry experience to the company. Most recently, Mr. Krause served as Executive VP at Tundra Semiconductor. Steve Farnow, PhD, VP of Operations, brings 25 years of semiconductor operations experience from Intel and TI, and most recently as VP of Operations at Hi/fn. Atsana has raised US $16M in financing from semiconductor and wireless focused VCs including Stata Venture Partners (Boston, MA), Atsana&s;s Series A round lead financer. Other investors include the Viterbi Group (San Diego, CA), BDC (Ottawa, ON), Entrust Capital (New York, NY), Primaxis Technology Ventures (Toronto, ON) and the Topol Group (Boston, MA).

Contact Phone:

Contact Email: